CBR02C308B3GAC
Multilayer Ceramic Capacitors MLCC - SMD/SMT 25volts 0.3pF C0G 0201
廠商型號:
CBR02C308B3GAC
芯天下內(nèi)部編號:
196-CBR02C308B3GAC
生產(chǎn)廠商:
Kemet
描述:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 25volts 0.3pF C0G 0201
產(chǎn)品類別:
Passive Components|Capacitors|Ceramic Capacitors|Multilayer Ceramic Capacitors MLCC - SMD/SMT
所示圖像僅為示意圖。請從產(chǎn)品數(shù)據(jù)表中獲得準確的規(guī)格。
庫存與訂購
產(chǎn)品參數(shù)
| 參數(shù)類型 | 參數(shù)值 |
|---|---|
| Capacitance | 0.3 pF |
| Tolerance | 0.1 pF |
| Voltage Rating | 25 V |
| Temperature Coefficient / Code | C0G |
| Case Code - in | 0201 |
| Case Code - mm | 0603 |
| Operating Temperature Range | - 55 C to + 125 C |
| Product | Low ESR MLCCs |
| Dimensions | 0.3 mm W x 0.6 mm L x 0.3 mm H |
| Package / Case | 0201 (0603 metric) |
| Series | CBR |
| Factory Pack Quantity | 15000 |
| Termination Style | SMD/SMT |
| Life | New Product: New from this manufacturer. |
| Mounting Type | Surface Mount, MLCC |
| Voltage - Rated | 25V |
| Packaging | Tape & Reel (TR) |
| Temperature Coefficient | C0G, NP0 |
| Size / Dimension | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
| Applications | RF, Microwave, High Frequency |
| Operating Temperature | -55°C ~ 125°C |
| Standard Package | 15,000 |
| Thickness (Max) | 0.013" (0.33mm) |
| Package/Case | 0201 (0603 Metric) |
| Other Names | 399-6136-2 |
| Features | High Q, Low Loss |
| rohs | Lead free / RoHS Compliant |
| Depth | 0.3mm |
| Dielectric | C0G |
| Height | 0.3mm |
| Length | 0.6mm |
| Maximum Operating Temperature | +125°C |
| Minimum Operating Temperature | -55°C |
| Tolerance Minus | 0.1pF |
| Tolerance Plus | 0.1pF |
| Voltage | 25 V dc |
| Product Category | Multilayer Ceramic Capacitors MLCC - SMD/SMT |
| Case Length | 0.6 mm |
| Case Height | 0.3 mm |
| Case Width | 0.3 mm |
| Type | C0G Dielectric, Ultra High Q, Low ESR, RF and Microwave |
| Part # Aliases | CBR02C308B3GACTU |
| RoHS | RoHS Compliant |
| Operating Temp Range | -55C to 125C |
| Rad Hardened | No |
| Failure Rate | Not Required |
| Construction | SMT Chip |
| Tolerance (+ or -) | 0.1pF |
| Temp Coeff (Dielectric) | C0G |
| Wire Form | Not Required |
| Mounting Style | Surface Mount |
| Product Length (mm) | 0.6 mm |
| Product Depth (mm) | 0.3 mm |
| Product Height (mm) | 0.3 mm |
| Case Style | Ceramic Chip |
| Product Diameter (mm) | Not Required mm |
| 系列 | C, CBR |
| 電壓 | 25 V dc |
| 容差 | ±0.1pF |
| 最高工作溫度 | +125°C |
| 安裝類型 | 表面貼裝 |
| 容差 正 | +0.1pF |
| 電介質(zhì) | C0G |
| 高度 | 0.3mm |
| 電容值 | 0.3 pF |
| 最低工作溫度 | -55°C |
| 溫度系數(shù) | ±30ppm/°C |
| 長度 | 0.6mm |
| 電介質(zhì)材料系列 | 陶瓷 |
| 封裝/外殼 | 0201 |
| 容差 負 | -0.1pF |
| 深度 | 0.3mm |
| Board Level Components | Y |
| 尺寸 | 0.6 x 0.3 x 0.3mm |
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